Reducing Stress Concentration Factor around a Hole on a Plate by Piezoelectric Patch

Abstract

Using piezoelectric patches, the stress concentration around a hole on a plate under tension is reduced and controlled. For this purpose, two placements for piezoelectric patches around the hole are investigated. First, the piezoelectric patches are located at top/bottom of the hole with compression induced strain. This location controls the stress concentration directly. Then piezoelectric patches are located at left/right of the hole with tension induced strains to control the stress flow in plate and reduce the stress concentration indirectly. The result sprung from the above conditions is presented for host plate and piezoelectric patches, and by comparing the mentioned results, the advantages of locating the piezoelectric patches to control the stress flow in the host plate is investigated. Based on the related results, locating piezoelectric patches at left/right of the hole can affect the stress flow around the hole and control the stress concentration factor indirectly.