| نویسندگان | محمد صدیقی-مهدی عاصم آبادی-محمد هنرپیشه |
| نشریه | MATER DESIGN |
| تاریخ انتشار | 2012-5-01 |
| نمایه نشریه | ISI ,SCOPUS |
چکیده مقاله
In this study, an Al/Cu/Al multilayer sheet was fabricated by explosive welding process and the effects of
annealing temperature on the interfacial properties of explosively bonded Al/Cu bimetal have been investigated.
For this purpose, hardness changes along the thickness of the samples have been measured, and
the thickness and type of intermetallic compounds formed at the joining interface have been explored by
means of optical microscopy (OM), scanning electron microscopy (SEM) and also energy dispersive spectroscopy
(EDS). The obtained results indicate that, with the increase of the annealing temperature, the
thickness of intermetallic compounds has increased and the amount of hardness along the thickness of
the joining interface has diminished. In the annealed sample at 400 C for 30 min, it was observed that
intermetallic layers have formed at the interface of Al/Cu bimetals. These layers consist of the intermetallic
compounds AlCu3, Al2
Cu and AlCu, and their thickness gets to about 5 lm at some points. The
examinations performed by the SEM, following the Vickers micro-hardness test, indicated the existence
of a number of microcracks at the top and bottom interface of the sample annealed at 400 C. This shows
the formation of brittle intermetallic compounds at the joining interface, and also indicates the low ductility
of these compounds.